ERUTM64-50 Infrared thermal imaging module

ERUTM64-50 Infrared thermal imaging module

Description

ERUTM64-50 640×512 Uncooled Infrared Thermal Core Module

Compact, Lightweight and Low-Power Thermal Imaging Core for OEM Integration

The ERUTM64-50 is a high-performance 640×512 uncooled infrared thermal core module designed for OEM manufacturers, system integrators, and thermal imaging equipment developers. Featuring a highly sensitive vanadium oxide (VOx) infrared detector with a 12μm pixel pitch, the module delivers clear thermal imagery, excellent temperature sensitivity, and stable operation in demanding environments.

With its compact dimensions of only 26mm × 26mm × 25mm and weight below 25 grams (excluding lens and flange), the ERUTM64-50 is ideal for applications where size, weight, and power consumption are critical. The module consumes less than 0.85W during normal operation, making it particularly suitable for battery-powered systems, portable thermal devices, UAV payloads, robotics platforms, and wearable thermal imaging equipment.

The thermal core integrates advanced image processing algorithms, including non-uniformity correction, digital detail enhancement, temporal and spatial noise reduction, and intelligent image optimization. These technologies ensure sharp thermal images, improved target recognition, and reliable performance under various environmental conditions.

Key Features

  • 640×512 high-resolution uncooled VOx infrared detector
  • 12μm pixel pitch for enhanced image detail
  • Long-wave infrared spectrum (8–14μm)
  • NETD ≤35mK for excellent thermal sensitivity
  • Smooth 50Hz real-time thermal video output
  • Ultra-low power consumption (<0.85W)
  • Compact and lightweight design for embedded systems
  • Multiple digital interfaces including BT656, CameraLink, MIPI, USB and SDI
  • Support for UART and RS232 communication
  • Built-in image enhancement and digital zoom functions
  • Industrial-grade operating temperature range from -40°C to +60°C

Designed for OEM Thermal Imaging Development

The ERUTM64-50 thermal imaging core is specifically developed for OEM integration into compact thermal imaging systems. Its small footprint and flexible interface options allow manufacturers to reduce development time and accelerate product deployment.

Supported customization options include USB, BT656, MIPI, SDI, CVBS and other interface expansion solutions to meet diverse integration requirements.

Typical Applications

The ERUTM64-50 is widely used in:

  • UAV thermal cameras and aerial inspection systems
  • Search and rescue equipment
  • Robotics and autonomous navigation platforms
  • Industrial inspection and predictive maintenance systems
  • Vehicle and marine thermal vision devices
  • Security and surveillance cameras
  • Firefighting thermal imagers
  • Wearable and helmet-mounted thermal imaging devices
  • Multi-sensor fusion and intelligent perception systems

Why Choose ERUTM64-50

Compared with conventional thermal imaging modules, the ERUTM64-50 offers an outstanding balance of image quality, power efficiency, compact size, and integration flexibility. Its high thermal sensitivity and advanced image processing capabilities enable reliable target detection and thermal analysis even under challenging environmental conditions.

For OEM developers seeking a lightweight thermal imaging core with professional-grade performance, the ERUTM64-50 provides an ideal solution for next-generation infrared products.

Component ModelERUTM64-50
Detector TypeUncooled vanadium oxide infrared focal plane array detector
Resolution640×512
Detector Frame Rate50Hz
Pixel Pitch12um
Operating Wavelength Range8~14um
Noise-Equivalent Temperature Difference (NETD)≤35mK@25℃,F#1.0
Image Adjustment
Brightness Adjustment0–10 levels available
Contrast Adjustment0–10 levels available
Enhancement0–10 levels available
False ColorMultiple color palettes, including black-and-white, white-and-black, iron red, and red-hot
Digital Zoom1~4X
 

 

Image Processing

Non-uniformity correction
Time-domain filtering
Spatial filtering and noise reduction
Digital detail enhancement
Histogram-based exposure adjustment
Power Supply
Supply Voltage5V±0.5
Typical Power Consumption @ 25°C<0.85 W (without expansion pack)

<1.2 W (with expansion pack)

Module Interface
Digital VideoBT656/Camerlink/MIPI/USB/SDI etc.(Replace the interface board)
Communication InterfaceUART*2/RS232*2
Physical Characteristics of the Module (excluding lens and flange)
Weight<25g
Dimensions26mm×26mm×25mm
Environmental adaptability
Operating Temperature-40℃~+60℃
Storage Temperature-40℃~+80℃
Humidity5%–95%, non-condensing
Vibration6.06 g, random vibration, all axes
Shock80 g @ 4 ms, sawtooth waveform, 3 axes, 6 directions

Advantages of ERUTM64-50 Thermal Core

The ERUTM64-50 combines high thermal sensitivity, compact dimensions and ultra-low power consumption in a single thermal imaging solution. As a result, developers can integrate the module into lightweight platforms without compromising imaging performance.

Furthermore, the 640×512 resolution provides significantly more thermal detail than lower-resolution thermal cores. Therefore, users can identify targets more accurately and perform thermal analysis with greater confidence.

In addition, the module supports multiple digital video interfaces, allowing system integrators to simplify product development and reduce engineering costs. Consequently, OEM manufacturers can shorten product development cycles and accelerate time to market.

Moreover, the industrial-grade design ensures reliable operation in harsh environments. Whether deployed on UAVs, robotic systems, thermal cameras or security equipment, the ERUTM64-50 delivers stable thermal imaging performance.

Frequently Asked Questions

What detector technology is used in the ERUTM64-50?

The ERUTM64-50 uses a high-sensitivity uncooled vanadium oxide (VOx) infrared focal plane array detector with a resolution of 640×512 and a 12μm pixel pitch.

What is the thermal sensitivity of the ERUTM64-50?

The module offers a NETD of ≤35mK, allowing it to detect very small temperature differences and produce clear thermal images in low-contrast environments.

Is the ERUTM64-50 suitable for UAV integration?

Yes. Its compact size, lightweight structure, and ultra-low power consumption make it an excellent choice for UAV thermal payloads and airborne thermal imaging systems.

What interfaces does the ERUTM64-50 support?

The module supports BT656, CameraLink, MIPI, USB, SDI, UART and RS232 interfaces. Additional interface expansion boards can be customized according to project requirements.

Can the ERUTM64-50 be customized for OEM projects?

Yes. The module is specifically designed for OEM integration and supports customized interfaces, expansion boards, and development support for different application scenarios.

What industries commonly use the ERUTM64-50?

Typical industries include security and surveillance, industrial inspection, robotics, UAV systems, firefighting equipment, automotive electronics, marine observation, and intelligent sensing systems.